AMD Mobile Sempron 3400+ - SMS3400HAX3CM

 

 

CPU s 6 měs. Zárukou - NEPOŠKOZENÉ .. 

 

Pochazí z Acer Aspire 3100 Model: BL51

 

 

JSME PLÁTCI DPH- Doklad samozřejmostí !!

 

 

 

Přejeme příjemnou aukci. 

 

 

 

 Čtěte stránku o mně.

 

AMD Mobile Sempron 3400+ specifications

 

General information
Type	CPU / Microprocessor
Market segment	Mobile
Family	AMD Mobile Sempron
Model number  ?	3400+
CPU part number	SMS3400HAX3CM is an OEM/tray microprocessor
Stepping codes	ABBVF   LEBAF   LFBAF   NEBAF   NFBCF
Frequency  ?	3400+ (rated) 1800 MHz (real)
Clock multiplier  ?	9
Package	638-pin lidless micro-PGA 1.38" x 1.38" (3.5 cm x 3.5 cm)
AMD Package number	29249
Socket	Socket S1 (S1g1)
Weight	0.2oz / 6.8g
Architecture / Microarchitecture
Microarchitecture	K8
Processor core  ?	Keene
Core stepping  ?	F2
Manufacturing process	0.09 micron
Data width	64 bit
The number of cores	1
The number of threads	1
Floating Point Unit	Integrated
Level 1 cache size  ?	64 KB instruction cache 64 KB data cache
Level 2 cache size  ?	256 KB
Multiprocessing	Uniprocessor
Features	MMX instructions 3DNow! technology SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 AMD64 / AMD 64-bit technology  ?  EVP / Enhanced Virus Protection  ?
Low power features	PowerNow! technology
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR2
Other peripherals	One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical / Thermal parameters
V core  ?	1.125V / 1.15V / 1.2V
Maximum operating temperature  ?	95°C
Thermal Design Power  ?	25 Watt

CPU s 6 měs. Zárukou - NEPOŠKOZENÉ .. Pochazí z Acer Aspire 3100 Model: BL51 JSME PLÁTCI DPH- Doklad samozřejmostí !! Přejeme příjemnou aukci. Čtěte stránku o mně. AMD Mobile Sempron 3400+ specifications General information Type CPU / Microprocessor Market segment Mobile Family AMD Mobile Sempron Model number ? 3400+ CPU part number SMS3400HAX3CM is an OEM/tray microprocessor Stepping codes ABBVF LEBAF LFBAF NEBAF NFBCF Frequency ? 3400+ (rated) 1800 MHz (real) Clock multiplier ? 9 Package 638-pin lidless micro-PGA 1.38" x 1.38" (3.5 cm x 3.5 cm) AMD Package number 29249 Socket Socket S1 (S1g1) Weight 0.2oz / 6.8g Architecture / Microarchitecture Microarchitecture K8 Processor core ? Keene Core stepping ? F2 Manufacturing process 0.09 micron Data width 64 bit The number of cores 1 The number of threads 1 Floating Point Unit Integrated Level 1 cache size ? 64 KB instruction cache 64 KB data cache Level 2 cache size ? 256 KB Multiprocessing Uniprocessor Features MMX instructions 3DNow! technology SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 AMD64 / AMD 64-bit technology ? EVP / Enhanced Virus Protection ? Low power features PowerNow! technology Integrated peripherals / components Integrated graphics None Memory controller The number of controllers: 1 Memory channels: 2 Supported memory: DDR2 Other peripherals One 16-bit HyperTransport link with speeds up to 800 MHz Electrical / Thermal parameters V core ? 1.125V / 1.15V / 1.2V Maximum operating temperature ? 95°C Thermal Design Power ? 25 Watt